Kontron 2.5"-SBC-AML/ADN: Packing Dual 2.5GbE, 3x 4K, and 2x M.2 into 100x72mm
Kontron is deploying the "2.5"-SBC-AML/ADN", a Pico-ITX (100x72mm) SBC. Supporting Intel Atom x7000(R)E, Core i3-N305, and N97, it offers dual 2.5GbE, 3-screen 4K output, and M.2 expandability for edge gateways.
Kontron is deploying the Kontron 2.5”-SBC-AML/ADN (announced Oct 7, 2024, samples expected Nov 2024). Product info and datasheets are on the official page.
This Pico-ITX (100x72mm) single-board computer supports Intel Atom x7000(R)E and Alder Lake-N series (Core i3-N305, N97, etc.). It’s an SBC for edge gateways packing dual 2.5GbE, 3-screen 4K output, and dual M.2 expansion into a small board.
However, since memory and eMMC are onboard, it’s not suitable for “add more RAM later” strategies. Initial capacity planning is crucial.
Intel Atom x7211RE/x7433RE/x7835RE, Core i3-N305, N97, etc. (Depends on SKU)
GPU
Intel UHD Graphics (Gen12). Deep Learning Boost for AI inference mention, no dedicated NPU confirmed
Memory
LPDDR5 4800, 4/8/16GB (Onboard)
Storage
eMMC 32/64/128GB (Onboard)
Expansion
M.2 Key B (2242/3042/3052/2280, PCIe x2/USB2/SATA/UIM), M.2 Key E (2230, PCIe x1/USB2/CNVi) + SIM Holder
Network
2x 2.5GbE (RJ45, Intel I226-V/IT). TSN support noted for Atom series
Video
eDP x1, DP x1, USB-C (DP Alt) x1 for max 3 screens (4096x2160@60)
USB
USB 3.2 (Type-A/Type-C). USB-C supports DP Alt + PD 5V/3A
Serial
2 ports (RS232/422/485 option)
Other I/O
DI/DO, TPM 2.0
Power
DC 9-20V Input, CPU TDP approx 6-15W
Size
100x72mm (Pico-ITX)
OS
Windows 10/11, Linux
A Pico-ITX SBC packing Dual 2.5GbE, 3-screen 4K, and 2x M.2 into 100x72mm, slightly larger than a credit card.
Attractive balance of I/O and expandability as a base for edge gateways or small industrial PCs, but memory/eMMC are fixed.
Features
SoC / CPU
The key point is “Selectable Low-Power Intel CPUs”. Choosing from Atom x7000(R)E (Amston Lake) or Alder Lake-N (i3-N305, N97) allows targeting the 6-15W TDP range.
Regarding AI, “Fast AI Inference” is claimed, but don’t misinterpret this as having a dedicated NPU. It relies on CPU instructions (Deep Learning Boost) or iGPU (Gen12).
Practically, N97/i3-N305 are balanced for “General + Light Inference + Multi-Display”. x7000RE fits “Industrial Temp, Long Supply, Real-time” needs, with TSN/TCC support.
Memory & Storage
LPDDR5 Onboard (4/8/16GB). Hard to upgrade, but better vibration/shock resistance—a classic industrial tradeoff.
Storage is also eMMC Onboard. Good for OS robustness, but capacity expansion relies on M.2.
M.2 Key B (SSD/WWAN) and Key E (WLAN/BT) are the expansion mainstays. Key B supports PCIe x2/SATA, offering high freedom.
Common setup: minimal OS/logs on eMMC, apps/data on M.2 SSD. Or Key E for Wi-Fi, Key B for LTE/5G.
Network & Video
Dual 2.5GbE. Approx 2.5x bandwidth of 1GbE. Reduces congestion for video streams or log uploads if the server side supports it.
Video supports max 3 screens via eDP (Internal) + DP (External) + USB-C (DP Alt). E.g., “4K60 on DP, 4K60 on USB-C, 4K60 on eDP”. Great for signage.
I/O includes USB 3.2, Serial, and DI/DO, properly covering “field connectivity”. TPM 2.0 adds security value.
Exterior
Pico-ITX (100x72mm) fits easily into small housings, but requires upfront thermal and cable routing design.
Starter kits help visualize necessary components. Having brackets and cabling from the start aids PoC.
Brackets to expose internal USB headers as rear USB-A ports are available, useful for compact chassis designs.
Thermal design is tied to the case for this size. Quoting thermal parts early is safe.
Summary
Kontron 2.5”-SBC-AML/ADN hits the sweet spot as a “Base for Edge Gateways/Small IPCs” by offering Dual 2.5GbE + 3x 4K + 2x M.2 in a small board.
Suited for: Video/Signage + High bandwidth NW, Field devices needing Serial/GPIO, Industrial apps needing long supply/temps.
Not suited for: “Upgrade RAM later” operations. LPDDR5/eMMC onboard requires commitment.
Personally, I like the ruggedness of onboard memory, but risky if PoC requirements fluctuate. Define capacity needs early.
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