Radxa

Radxa has published the product page and official documentation for the "Radxa Cubie A7Z." This ultra-compact SBC packs an Allwinner A733 (Cortex-A76×2 + Cortex-A55×6) and a 3 TOPS-class NPU into a 65×30mm form factor, complete with Wi-Fi 6 and Micro HDMI. However, wired LAN and M.2 require expansion, and PCIe is limited to Gen3 x1 via FPC, so checking whether it fits your use case beforehand is recommended.

Radxa has published the "Radxa Dragon Q6A" on their official page and Product Brief (Rev 1.4, updated October 24, 2025). This industrial SBC packs Qualcomm QCS6490, Wi-Fi 6, Bluetooth 5.4, 3 MIPI CSI ports, and M.2 2230 NVMe into an 85×56mm form factor. However, AI performance and cooling requirements depend on OS/SDK and implementation conditions, so checking the official Docs before deployment is recommended.

As of December 29, 2025, we could not find a dedicated product page or official documentation for the "Radxa NIO 5A" from Radxa official primary sources. This article organizes what we could verify about the NIO series positioning from primary sources, how to find purchase options through official distributor listings, and the checklist of unverified items from an SBC perspective.

Radxa (Fogwise®) announced the official release of "Fogwise AIRbox Q900" on Sep 30, 2025. Powered by Qualcomm Dragonwing IQ-9075 with max 200 TOPS (INT8 sparse) NPU, 36GB ECC memory, and dual 2.5GbE, it targets on-site inference needs.

Radxa announced the 'Radxa C200 Orin Developer Kit'. Combining a Jetson Orin NX 8GB module with a dedicated IO board, it's a dev kit strongly focused on robotics and industrial edge AI. It highlights 'Max 117 TOPS' via Super mode (MAXN_SUPER), though official docs note performance depends on procedures.